Today, a heady revelation has rocked the tech world: Samsung is starting mass production of its thinnest DRAM memory on the market. This advancement could transform the capabilities of modern mobile devices, pushing the boundaries of what is technically possible.
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A look at this new feature
Samsung has launched mass production of its new LPDDR5X DRAM, which is said to be the thinnest in the industry at just 0.65mm thick. This represents a significant reduction from traditional dimensions, providing better thermal management, which is essential for AI applications on mobile devices. This new feature enables easier integration into increasingly thin and light smartphone designs, and optimizes energy efficiency.
Innovation and design
The development of these chips is the result of Samsung’s 12nm process technology. The new memories will be available in capacities of 12GB and 16GB, benefiting from an innovative 4-layer design. This feat is made possible by meticulous adjustments to the printed circuit board, the epoxy molding compound and the back-side polishing process. These improvements reflect Samsung’s commitment to pushing the boundaries of what is possible in terms of device miniaturization and performance.
Advantages for smartphones
Beyond just reducing thickness, this new memory offers performance benefits. According to Samsung, the increased thermal efficiency would allow for better airflow inside devices, which is crucial for high-performance applications, such as embedded AI. This could allow smartphone makers to explore new avenues in terms of design and functionality, making devices not only more aesthetically pleasing but also more powerful.
Comparison with previous models
The new 0.65mm chips are 9% thinner than standard LPDDR5X modules, and heat resistance has been increased by over 21% compared to previous generations. However, the impact on reducing the thickness of phones remains to be seen, as manufacturers are using various techniques to slim down their devices. However, this development could set a new standard in the industry, prompting other companies to follow suit.
An increase in the range planned
Samsung isn’t stopping there; the company plans to further increase LPDDR5X density with 24GB and 36GB packages. In April, Samsung also unveiled what it claims is the fastest LPDDR5x DRAM on the market. These advances suggest a race toward ever bolder innovations to meet the growing demands of mobile and AI technologies.
Practical use of thermal capacity
Of course, these improvements don’t mean much if smartphone makers don’t take advantage of them. Samsung is looking to expand the capabilities of its Galaxy AI with innovative camera features like auto-zoom and cartoon-style filters for portraits. It remains to be seen how many of these AI-powered features will actually run locally on the hardware. Thermal flexibility could enable more demanding applications without compromising the durability or performance of the devices.
The Current State of AI on Mobile Devices
Despite all the hype around on-device AI, there are no complex generative models running on mobile chips yet. Current devices barely handle a few text prediction functions, without really challenging the thermal capabilities of smartphones. This raises questions about the current limitations of the technology and the future of embedded AI capabilities in mobile contexts.
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This article explores Samsung’s latest innovations in ultra-thin DRAM production. This technical advancement promises better thermal management and increased performance for mobile AI applications, raising the question of what impact this will have on smartphone design in the future. Ultimately, these developments could herald a new era in mobile device design and functionality.
Source: Samsung Press Release